Biblio

Electrical Characterization of the Embedded Capacitance Material and its Application in Power Supply Decoupling, Zheng L., Mathewson A., O'Flynn Hayes B. M., and C. O'Mathuna , ECTC 2011, 31May-3Jun, 2011, Florida, USA, (2011)

An Investigation of Pulse Transit Time as a Non-Invasive Blood Pressure Measurement Method, McCarthy, B. M., O’Flynn Mathewson B. A., and O'Mathuna C. , Sensors and Their Applications XVI, 12-14 Sep, 2011, Cork, Ireland, (2011)

Impact study of substrate materials on wireless sensor node RF performance, Liqiang ZHENG, Alan MATHEWSON, Brendan O'FLYNN Michael HAYES Cian O'MATHUNA , Materials Science Forum, Volume 663-665, p.455-461, (2011)

A Passive Circuit Based RF Optimization Methodology for Wireless Sensor Network Nodes, Zheng, L., Mathewson O'Flynn Hayes O'Mathuna A. B. , Advanced Materials Research, Volume 267, p.1059-1064, (2011)

Design and Implementation of the Embedded Capacitance Layers for Decoupling of Wireless Sensor Nodes, Liqiang ZHENG, Alan MATHEWSON, Brendan O'FLYNN Michael HAYES Cian O'MATHUNA , 12th Electronics Packaging Technology Conference, 8-10 Dec, 2010, Singapore, (2010)

Tyndall Physiological Health Monitoring System, Brian M. McCarthy, Brendan O’Flynn, Alan Mathewson , 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference, 22－25 Sep, 2010, Wrocław, (2010)

Statistical method of modeling and optimization for wireless sensor nodes with different interconnect technologies and substrates, L. Zheng, A. Mathewson, O’Flynn Hayes B. M., and O’Mathuna C. , International Conference on Electronic Packaging Technology & High Density Packaging, 16-18 Aug, 2010, Xi’an, China, (2010)

A simulation-based design method to transfer surface mount RF system to flip-chip die implementation, L. Zheng, Kenneth Rodgers, Mathewson O’Flynn Hayes O’Mathuna A. B. M. C. , Electronics System Integration Technology Conferences (ESTC), 13-16 Sep, 2010, Berlin, Germany, (2010)

Impact study of substrate materials on wireless sensor node RF performanc, L. Zheng, A. Mathewson, O’Flynn Hayes B. M., and O’Mathuna C. , 2010 International Conference on Optical, Electronic and Electrical Materials, 1-4 Aug, 2010, Kunming, China, (2010)

Miniaturization of Wireless Sensor Network Nodes, L. Zheng, A. Mathewson, O’Flynn Hayes O’Mathuna B. M. C. , Carpathian Journal of Electronic and Computer Engineering, Volume 3, Issue 1, (2010)

Wearable wireless inertial measurement for sports applications, Gaffney, Mark, O'Flynn Brendan, Mathewson A., Buckley John, Barton John, Angove Philip, Vcelak J., O'Conaire Ciarán, Healy Graham, Moran Kieran, et al. , In: IMAPS-CPMT - 33rd International Microelectronics and Packaging Poland Conference, 21-24 Sep 2009, Gliwice - Pszczyna, Poland, (2009) Abstract

Effect of Solder Volume on joint shape with variable chip-to-board contact pad ratio, Jesudoss, P., Mathewson A., Wright W., O'Flynn B., and Stam F. , In: XXXII International Microelectronics and Packaging Poland Conference, 21-24 Sep 2008, Warszawa-Pułtusk, Poland, (2008) Abstract